Автоматизированная установка для компоновки электронных блоков FINEPLACER® pico 2

высокой точности

Multi-Purpose Manual Die Bonder The FINEPLACER® pico 2 is a versatile manual die bonder with placement accuracy down to 3 µm. Quick to set up and easy to operate, it is ideal for rapid product development and prototyping in R&D labs and universities. Designed for flexibility, the system supports numerous technology and process modules as well as application-specific tools. Users can integrate third-party functionalities and customize the system as needed. The modular architecture allows on-site retrofitting throughout its service life. Getting started is effortless. A high-resolution vision alignment system with adaptable fields of view and adjustable RGB illumination ensures optimal contrast between components and substrates, making manual alignment easy and reliable. The spacious working area accommodates 300 mm wafers and supports batch processes. A high-resolution bonding force module with a wide force range enables precise handling of various components. With the intuitive IPM Command bonding software, process creation is seamless. Users can focus on core application tasks while minimizing operating errors. The software offers extensive parameter control for process optimization. Following the “Prototype to Production” approach, the FINEPLACER® pico 2 features a unified hardware and software platform, ensuring a smooth transition from development lab to production. Combining application flexibility, technological diversity, process reliability, and compatibility with Finetech’s automated production bonders, it delivers excellent return on investment and is a natural starting point on the path from concept to final product.