Вся продукция Shenzhen DeepMaterial Technologies Co.
UV Curing UV Adhesive
Reactive Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive
Epoxy-Based Chip UnderfiLL & COB Encapsulation Material
Epoxy Based Conductive Silver Adhesive
Structural Bonding Adhesive
Functional Protective Film
Semiconductor Protective Film
Anaerobic Adhesives
Adhesive For Photovoltaic Applications
Thermal Adhesive
underfill epoxy
Mems Adhesive
Two-component glue, plastic transparent glue
Lens Bonding Adhesive
Electrically insulating adhesive
Cyanoacrylate Adhesives
Threadlockers
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